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Global In-Mold Electronics Leaders Head to IMSE Days 2.0

TactoTek conference features experts in design, materials, production and testing in automotive, industrial, smart home and consumer markets.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

TactoTek, the global leader in injection molded structural electronics (IMSE) technology, with support from Platinum sponsor MacDermid Performance Solutions, Silver sponsors Altium and Niebling, and presenters from across the in-mold electronics ecosystem, will convene the IMSE Days 2.0 conference on June 5, 2019 in Oulu, Finland.
 
Printed electronics are at the core of IMSE solutions, and Oulu is the center of a region globally known for printed electronics innovation, and home to leaders in printed electronics research, development and industrialization.
 
“Demand for IMSE solutions, single piece seamless parts that integrate electronic functions including touch controls, lighting and wireless communications, within 3D injection molded structures, is growing quickly across markets, including automotive, industrial, smart home and consumer use cases,” said Dave Rice, SVP marketing at TactoTek. “This event is designed to accelerate learning by sharing knowledge across the ecosystem and building relationships that are the foundation of successful projects.”
 
Announced speakers at IMSE Days 2.0 include Faurecia, Novem, Bö-La, OSRAM, Cypress Semiconductor, MacDermid, Covestro, OptoFidelity, TactoTek, and will include presentations and live demonstrations of printed electronics and mechanics computer-aided design (CAD) from Altium and Dassault Systémes.
 
To learn more about IMSE Days 2.0 and register online, visit: https://tactotek.com/imse_days_20/ 

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